Electronics Forum | Thu Nov 03 02:16:55 EDT 2022 | spacecase
Hey I'm having an issue with a samsung 421f component placer. The machine is fine on the first 5 boards then on the 6th or so it just throws them wherever. The problem is the smallest flat components start sticking to the nozzle even after hitting th
Electronics Forum | Tue Mar 07 08:44:29 EST 2023 | spoiltforchoice
> Does the 'R' suffix not mean a rotary head on the > machine? This will then allow for that head to be > a 'chip shooter' but does so with a lower height > off the PCB being assembled. That is, the rotary > head offers some gain i
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Wed Nov 10 11:31:06 EST 1999 | John Thorup
Hello Horace You're lucky in that you have two of the same machine. You should be able to arrive at the root of the problem by comparison. The problem is likely to occur in one or more of these areas: MACHINE: As said , pump speed and air contact ar
Electronics Forum | Mon Sep 20 12:19:13 EDT 1999 | Brian
| Hi all, | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. | | We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the S
Electronics Forum | Wed Jun 16 10:44:04 EDT 1999 | Clifford Peaslee
Brian, Thanks for your concern, and maybe there is fear that we are trying to mislead people, which is not true. We do not have the server in house here in Portland, Maine. It is in Fort Lauderdale, Florida, at Advances.com. We are sharing a netw
Electronics Forum | Thu May 06 09:24:06 EDT 1999 | Joe Manzur
Kevin, We are also looking at printing adhesive. Our application involves printing glue on the underside of the board, once it has gone through the dip, axial & radial process. In otherwords, there are leads cut and clinched and we have to mill out
Electronics Forum | Wed Jan 27 09:00:56 EST 1999 | Chris Fontaine
| | I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the
Electronics Forum | Wed Nov 18 17:18:59 EST 1998 | Tom
| My company is now using Fuji SMT machine, and is now considering to purchase QP132. Appreciate if sone one let me know about QP132's capability, relaiability and atability on the production. And what is advantages conpared to Philips FCM. | |Other
Electronics Forum | Thu Sep 17 10:39:36 EDT 1998 | Jim Gustin
| We are a small contract assembly shop hand placing SMT. We recently received a large contract for SMD that will require placement rates of at least 6,000 CPH. I am looking at Fuji, Mydata, Quad, and Zevatech. I have little experience with automated
