Electronics Forum | Wed Aug 23 12:14:15 EDT 2006 | jdengler
At a previous job we had a kit to splice the belts. It was a clamping and squeeze device and a soldering iron with a flat blade. You would cut the ends for a suare edge, put the belt in the clamp unit with a small gap. Use the iron to melt both en
Electronics Forum | Fri Aug 25 09:01:42 EDT 2006 | russ
We sire don't AJ, We use a single large aperture in center and the outer pads are just reduced our standard which is I believe about mil off of each side or 2 mils in X and Y. As far as side fillet, sometimes we get them sometimes we don't, I attri
Electronics Forum | Fri Sep 01 09:04:24 EDT 2006 | Cmiller
I believe that the reason Dover did not sell Dek is not so much based on its actual profitability but because the profits it does make are stable. I think Dek makes about 60% or its revenue on stencils and other consumables that are still in demand r
Electronics Forum | Fri Sep 01 15:33:29 EDT 2006 | Cmiller
Rick, I think Autosplice and Berg did that but of course, it was a little before my time. But the comparison is the same as what HP does with injet printers and the ink cartridges which for some reason made me think of a screen printer someone made t
Electronics Forum | Fri Aug 25 23:54:26 EDT 2006 | mika
If You adjust the focus to perfection, You still need the UIC GSM calibration kit, so that the machine will know where the spindles are according to the cameras (OTHC, P2P:s, fiducial camera), X-Y-Theta-spindles, nozzle changer, feederbanks and mach
Electronics Forum | Thu Aug 24 09:36:43 EDT 2006 | davef
Medium?? We prefer fully-baked. No, no. It's hearing messages from just about any dead component or board. "Wooo. Chunks. You dove me in the wave solder machine a year ago. I forgive you, because I never saw myself working in a karaoki bar."
Electronics Forum | Tue Aug 29 06:00:47 EDT 2006 | bwet
Ladies and Gents: There have been several studies including (http://www.solder.net/PDFs/LeadFree_BGATesting_InitialCycling_BEST.pdf) which have shown lower fast pass yields with solder paste. Based on internal projects of 1000+ of the same BGAs we a
Electronics Forum | Wed Aug 30 23:45:23 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 30 23:45:40 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Thu Aug 31 10:57:24 EDT 2006 | slthomas
Is it possible that he was testing you to see if you knew whether or not 610 addressed environmental specs? I had a consultant that was touring our plant ask me what aspect ratio we used on our stencils. I told him I like to keep it at 1.5 if I can.
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