Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
Electronics Forum | Mon Feb 13 14:34:31 EST 2006 | pjc
The best way to compare is ask each machine company to bring their machine in for a demo. Since they are bench-top machines, they are easy to transport. Pick one of your boards for them to run. Don't send any board data ahead of time. When they come
Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad
I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch
Electronics Forum | Thu Mar 08 08:03:16 EST 2007 | ck_the_flip
ENig can vary in quality, but I've never seen an ENiG board that's been downright unsolderable. At a CM where I worked, I had to prove a QE wrong. He was flippin' out (*no offense*) about black pad, something commonly seen on ENig boards, so what I
Electronics Forum | Sat May 17 09:42:10 EDT 2008 | realchunks
The Optimizer can be run through your wave like a regular board. It measures temps, times and parallelism of your waves in relationship to your board (pot to conveyor). Run the Optimizer till you get you temps, times and are parallel to your waves.
Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron
Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi
Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter
| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe
Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal
I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
