Electronics Forum | Thu Aug 09 15:16:20 EDT 2001 | Adam
Thank you Michael, yes we use a Fine Focus X-Ray machine, we also had some dummy connectors to play with, so we profiled the board until we reached a desirable profile. For placement we used a GSM machine, the only issue we ran into there is the par
Electronics Forum | Thu Aug 09 15:16:31 EDT 2001 | Adam
Thank you Michael, yes we use a Fine Focus X-Ray machine, we also had some dummy connectors to play with, so we profiled the board until we reached a desirable profile. For placement we used a GSM machine, the only issue we ran into there is the par
Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW
Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall
Electronics Forum | Mon Aug 13 05:17:16 EDT 2001 | nifhail
Normally the specs I monitored in our temperature profiles are Slope 1-2 Deg C/sec, preheat 60 - 120 Sec at 120 Deg C - 150 Deg C, peak 215+/- 10 Deg C, above 183 Deg C is 45 - 75 Sec, total reflow is 3 - 5 minutes. Why is it that we don't monitor
Electronics Forum | Thu Aug 30 13:35:06 EDT 2001 | arzu
first try to get rid of the problem instead of cleaning. Try Almit V16L for finepitch (good experience!) no, I do not work for that company... assuming that the rest of your process is perfect and you do not use old paste, do not use the same paste o
Electronics Forum | Fri Sep 07 10:46:23 EDT 2001 | davef
Comments are: * Sn42Bi58 is eutectic at 138�C. Most top-flight paste suppliers will produce it for you. * Bismuth forms an alloy with lead with a melting point of 93�C * Maximum temperature of the solder connection should be less than 100�C during
Electronics Forum | Mon Sep 10 02:47:27 EDT 2001 | Peter W.
Thank you for your annotaions. I am aware of the limits and temperatures of that material, but we are doing some research with thermoplastic base materials which won't survive standard solder paste reflow soldering. And beside of using conductive ad
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Wed Sep 26 16:31:30 EDT 2001 | davef
Wudduya mean ya can�t replace that ol� John Trieber? We agree. * Waverider thingies are best used to set-up process and in machine start-up. * Monitoring product characteristics is expensive, gives little information, and is so sloooow. [Plus we tu
Electronics Forum | Thu Oct 04 15:08:10 EDT 2001 | steve_
Hello everyone! Can somebody explain the advantages/disadvantages of a conveyer type reflow oven VS a batch oven. In conveyer type ovens, is the belt(conveyer) moving at a constant rate? If I have board that requires 20 seconds in pre-heat, 60 sec
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