Electronics Forum | Fri May 05 14:30:11 EDT 2000 | C.K.
I'd have to disagree with the Electrovert applications guy. I'd recommend SLOWING down the conveyor between .5 to 1 FPM - effectively, you're REDUCING contact length (because contact length = dwell time * conveyor speed), hence getting better peel-o
Electronics Forum | Wed Apr 19 14:07:20 EDT 2000 | Russ Cutler
Let me see if I've got this straight...rather than hook up a MOLE or a KIC profiler to each and every board (600 P/N's in my case), most people are making judgement calls based solely on how similar a board looks to another board, for which they have
Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa
Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor
Electronics Forum | Tue Apr 11 20:37:06 EDT 2000 | Dave F
Rich: Now that�s a great question!!! You�re corrrect. Primary-side temperature is the driver of the differences in the sensitivity to moisture between SMT and PTH devices that you�re finding. * Primary-side temperature for SMT ~= Secondary-side te
Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca
All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after
Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F
Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor
Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko
Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir
Electronics Forum | Mon Mar 27 21:25:01 EST 2000 | Dave F
Pete: Two angles on your question: 1 Yes, the layout of your board can affect the level of bridging you see. 2 That aside, the set-up of your machine also can affect the level of bridging on your board. Shaw, I could set-up your machine to bridge i
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
