Electronics Forum: defect (Page 189 of 226)

Re: Specifying Pcb Format/Construction. Help!!

Electronics Forum | Mon Apr 26 14:04:59 EDT 1999 | Steve Gregory

Hi Murray! Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads. OSP's hav

Re: Using solder paste in rework

Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon

| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not

Re: Bench marking Wave Solder

Electronics Forum | Fri Apr 23 14:14:49 EDT 1999 | Chrys Shea

| Hi everybody, | | I would like to bench mark the quality out of our wave soldering m/c as far as DPPM levels are concerned. Can somebody provide me with some figures at their site or anywhere else for the same. | | Thanks | Upinder | ====== | We

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 19:00:14 EST 1999 | Earl Moon

| | | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot o

Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford

AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M

| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure

Re: polyimide stencils

Electronics Forum | Thu Apr 22 15:27:44 EDT 1999 | Hugh M

| | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | You are hearing about polyimide as in polyimide film as Kapton (TM Dupont). This material is the stuff of flex and rigid/flex c

Re: Dicing Operation

Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman

I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a

Re: Measling

Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon

| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma

Re: Cracking Capacitors

Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos

Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th


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