Electronics Forum | Wed Jan 13 08:24:42 EST 1999 | Tenison Stone
I agree with Chrys. I want more information on the local seminars. My company does not send me to the big shows, but I can go to local seminars. The seminars are usually put on by the big companies, and if I am not on their mailing list I miss the
Electronics Forum | Fri Oct 23 16:19:14 EDT 1998 | Dave f
| I have been requested to explore the possibilities of using an inline lead trimmer in our manufacturing process. I have a few questions I need answered. | 1. Can anyone recommend a good model of trimmer for in-line use? | 2. We do double sided SMT,
Electronics Forum | Thu Oct 15 14:33:37 EDT 1998 | Earl Moon
| | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | Q: Can you get away with spending
Electronics Forum | Thu Oct 15 17:20:25 EDT 1998 | Justin Medernach
| | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | Q: Can you get away with sp
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Thu Jun 25 09:08:14 EDT 1998 | Russ Miculich
Thought I'd jump in as I helped develop materials for the FC game. Au/Pb - bumping - talk to Hughes Tuscon about this. They do it and will discuss the process. For Flip Chip Technology here in the States - contact Peter Elenius at Flip Chip Techno
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC
When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re
Electronics Forum | Tue Mar 19 09:17:16 EDT 2013 | rgduval
Any CSM84 geniuses out there? I've been working on these machines for about six months now, after spending 10 years on MyData's. I'm adjusting to the way the CSM's see the world, but, have run into something that I could use an assist with. I'm ha
