Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Tue Dec 01 12:44:15 EST 1998 | Earl Moon
| | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder joint
Electronics Forum | Tue Dec 01 13:53:12 EST 1998 | Brian Conner
| | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder
Electronics Forum | Wed Dec 02 09:03:34 EST 1998 | Dave F
| | | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect
Electronics Forum | Wed Feb 21 14:14:11 EST 2007 | rgduval
Hi, Bill, Lead-free solder and paste manufacturers will be a great resource for you during the transition; they've tested their products extensively, and their application groups have been able to help me through the biggest changes. There are a fe
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Tue Nov 07 02:50:41 EST 2000 | CharTrain
A solder wetting balance will indicate a time of less than one second for wetting to occur to a solderable surface. The additional time is required to get the metalized surfaces up to soldering temperature. A single sided board has very little mass a
