Electronics Forum: have (Page 1938 of 3474)

Re: PIHR

Electronics Forum | Thu Jul 20 14:31:20 EDT 2000 | Bob Willis

The process is not that difficult so have a go as soon as possible. Take a board wipe some paste on a board stick the part in and run it through the reflow process. Don�t worry about balling just see what you get first, that what I did first ! The m

Re: Paste Push-Out In PP Assembly

Electronics Forum | Thu Jul 20 12:59:52 EDT 2000 | Mike McMonagle

Bob, I attended your PIHR workshop at Nepcon a few years back. At the risk of making a shameless plug, I must say that the presentation and the materials used were some of the best I have seen in my many (20+) years in the industry. The video that is

Bismuth in solder wave

Electronics Forum | Tue Jun 06 14:31:42 EDT 2000 | Jeff Sanchez

I have 25#'s of bismuth in my shop. I wanted to add some to my 63/37 till it was eutectic. This would allow me to lower the waves temp. Can I do this and still meet standards? Also would it make the solder joints to brittle and would discoloration be

Solder balls

Electronics Forum | Thu May 17 08:28:14 EDT 2001 | wavemaster

I would have to agree that the leads are probably geting to hot, but there are many factors that could be the root cause. I would suggest doing a experiment with a solder sample and make 2 recipes. One with a relativly cold profile and one with a r

X Ray machines

Electronics Forum | Thu May 03 10:38:42 EDT 2001 | davef

You need to have a way to qualify and monotor your process. X-ray and ERSA's fiber optic inspection thingies are two approaches for doing that. There are lots of good x-ray machines out there. Get a transmissive x-ray machine with resolution of 10

Matrix Tray Holder

Electronics Forum | Mon May 07 22:25:21 EDT 2001 | Doug Kester

Has anyone heard of a single or double tray holder plate for Siemens Siplace equipment (either OEM or aftermarket). This would be similar to the Universal, Quad, and Zevatech platens for trays that just clip on to the feeder holders. Have only a co

Soldering to Immersion Tin surface finish

Electronics Forum | Fri May 11 10:30:26 EDT 2001 | rkevin

I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be different? Solderpaste considerations? Anything else? In the past I have experienced selective non

OSP vs HASL

Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri

The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav

Hardware Torque requirements

Electronics Forum | Wed May 16 08:33:27 EDT 2001 | caldon

STUMPED?? Is it the screw that determines the Torque setting or the assembly being fastened? All my Torque experience has been determined by the assembly..... Obviously the threads have torque specs but I dont think that is what we are talking about

Loctite Adhesive Viscosity

Electronics Forum | Tue May 15 08:40:52 EDT 2001 | Stefan Witte

The viscosity is only consistent over a small temperature range. If your room temperature has changed by a few degrees, it can make all the difference. You may have to increase the settling time. We did not check the viscosity, but measured the con


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