Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
Electronics Forum | Fri May 22 10:43:23 EDT 1998 | Mike Konrad
You're right Earl� Drag soldering is a dead issue as far as new technology is concerned. They do, however, work for most through-hole boards� but so do wave machines. There are only two manufacturers left that still produce drag soldering machine
Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F
| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s
Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Thu May 07 13:22:37 EDT 1998 | Chrys
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Thu May 07 12:54:01 EDT 1998 | DARRYL SCHLOSSER
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Thu Apr 30 15:04:37 EDT 1998 | Steve Gregory
| Hello - | I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any systems which are able to
Electronics Forum | Thu Apr 30 15:39:43 EDT 1998 | Earl Moon
| | | Hello - | | I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any systems which are
