Electronics Forum: heating (Page 200 of 301)

Re: Corroding Solder Joints

Electronics Forum | Tue Dec 28 21:02:15 EST 1999 | Jim

Hi Rick, Water soluble flux is heatee, deionized water. So, use DI, and keep it heated. It is also important that the water be moving, so that fresh water is continually being presented to the fluxed surfaces, and the flux-laden water is continually

Cure Ovens and Cycle Interuption

Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris

I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ

Re: Tombstoning

Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra

Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl

Re: Need advise on regarding Vias

Electronics Forum | Fri Dec 17 12:09:09 EST 1999 | Boca

Outstanding advice gentlemen! To borrow Dave F's line "I'd like to take a bit of a different angle." Ie. a few wave solder specific issues If this assembly is going over wave solder then avoid vias under passive components, it invites solder bal

Re: PCB interval during reflow process

Electronics Forum | Fri Dec 03 03:58:12 EST 1999 | Wolfgang Busko

Hi Charly, For batch ovens there is no discussion. For inline loading interval depends on the oven you use, the amount of heat the PCB takes out of the zone and the capability of the oven to get it back in. The approximate time for the PCB to stay i

Re: PCB interval during reflow process

Electronics Forum | Sun Dec 05 22:43:27 EST 1999 | dreamsniper

Charley, Though my reply is quite late, it might be a good info for you and i hope that this info could help or could provide you some views. Some companies practice at least 1 board gap, which means the length of the pcb you are currently loading,

Re: Double sided parts stuffing

Electronics Forum | Thu Nov 18 19:45:26 EST 1999 | Deon Nungaray

Deon Response: Hello Will, Yes, you can reflow a double sided board using 63/37 solder paste on both sides. There are some limitations as far as the mass of the components to reflow the second time. If you have doubts or are concerned that a compone

Re: Placement Equipment for 17 x 23 Backplanes?

Electronics Forum | Wed Nov 17 15:01:44 EST 1999 | Doug Philbrick

I am a Siemens person myself but you won't get 23", you can get 20 though and I believe you could feed in a 23" board length wise. If your parts fit in a 20" area 80F4 is the way I would go. My second choice would be MYdata. They are the large board

Re: Placement Equipment for 17 x 23 Backplanes?

Electronics Forum | Thu Nov 18 00:28:02 EST 1999 | Scott McKee

Use Mydata. I've built huge backplane boards, round boards, 1/4" thick boards, 1"X24" boards, 1"X1" boards, L-shapes boards; all without any carriers or tooling. If you buy a MY15 you can increase the board size to 5'X2' (60"X24")... As for ovens,

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber

According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c


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