Electronics Forum | Wed Sep 30 13:42:56 EDT 1998 | Chrys
Hello, I've been evaluating a bunch of wave solder fluxes and found one that is absolutely perfect. I'm so excited I can't wait to switch over. Unfortunately, I have to assure reliability, and the only test I have in-house is ionic contamination
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Sep 23 20:48:03 EDT 1998 | Dave F
| Konichi wa "SMT-netter" sans... | I've been on a fruitless search for some board mount, micro BGA sockets...I don't think they're out there yet, but I don't know for sure. | Found a lot of test and burn-in sockets for CSP's (at more than $1,000 pe
Electronics Forum | Mon Sep 14 07:19:34 EDT 1998 | Wayne Bracy
DB Sure, it is always possible to "duck in outside air" to use with production equipment, but be careful, you have to determine the air quality required for your process. Cosnsider moisture, contaminates and the actual forcing of air into a confine
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 10 21:48:37 EDT 1998 | Dave F
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Tue Sep 01 09:11:19 EDT 1998 | Brian Stumm
A new book, Speed to Market: How to Cut Lead Time and Increase Profits in Job Shops and Custom Manufacturing Environments can be previewed at Speed to Market (http://members.aol.com/ddilink) Praise from readers: Speed to Market is one of those book
Electronics Forum | Mon Aug 03 12:38:02 EDT 1998 | Dave F
| I am trying to obtain information on the US Heatsink market.I am trying to establish the top ten manufacturers, current trends, market shares etc Would anyone know where I could obtain such information ? I would appreciate any form of help. | Best
Electronics Forum | Wed Jul 29 20:53:44 EDT 1998 | Dave F
| Howdy all- | Does anybody have any experience with solid solder deposits as an alternative | to paste deposits? I have heard many good things, but do board fabricators have | the technology to do this? Where can I get more information on ho
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