Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Thu Feb 10 07:13:06 EST 2000 | JAX
Doug, If you are looking to reduce the size of your database you have many options. You can use the Jedec outline or Jedec name to standardize your component library. Otherwise you can set one up specific to the dimensional info you measure. If you
Electronics Forum | Wed Feb 09 10:20:26 EST 2000 | Sal
Currently we have started seeing an issue around a scuzzy connector.The problem being that during insertion of this connnector a couple of pins refused to be inserted and as a result fold over, this folding of the pin is causing the pin itself to fra
Electronics Forum | Fri Jan 19 12:26:16 EST 2001 | slthomas
Frankly I have no clue about whether or not the parts are good because our receiving inspection team is equipped with nothing more than a couple of caliper sets and a partial gauge pin set. There ARE things I miss about the medical instruments busin
Electronics Forum | Tue Jan 09 13:20:54 EST 2001 | JAX
Charlie, You might want to take a look at Valor. They have Package naming based on JEDEC/EIA standards already cataloged on an SQL-based library. Although the software takes you through the entire process of Data integration through Machine op
Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman
While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR
Electronics Forum | Fri Jan 05 15:14:27 EST 2001 | Mark Krmpotich
Currently where I work, we are busy running trials with smaller component sizes. Consumer Electronics is being driven to smaller and smaller products. Just look at the short history of the cell phone. Remeber when they used to look like Army Walki
Electronics Forum | Tue Jan 02 23:39:01 EST 2001 | Stevo
John, I'm no helicopter guru but maybe someone in these links can help. Good luck-Stevo Mario of MIA Micro-Flight fame has put a very nice diagram of how to hook-up seperate components in a Piccolo board fashion on his website. If you are thinking o
Electronics Forum | Mon Mar 25 04:28:21 EST 2002 | wbu
Hi Alex, rotation is always the problem and that goes with all conversion-SW. Unless you have strict rules for your CAD regarding the rotation it will always be a mess and you have to look at nearly each part individually. Once you have an agreemen
