Electronics Forum: dwell (Page 21 of 33)

BGA SEM test

Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper

Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Tue Aug 30 10:48:18 EDT 2005 | cmiller

If you do not have a lot of TH joints there are some advantages. No boards "submarined" in solder pot on wave. You can solder the bottome side SMT parts rather than epoxy them when the parts are put down. This should reduce SMT defects and missing pa

Solder sticking to Stainless Steel Fasteners

Electronics Forum | Wed Oct 12 20:53:44 EDT 2005 | mderen

We are currently wave soldering connectors that are held in place by stainless steel screws. About 20% of these screws emerge from the process with varying quantities of solder attached to them. We have just had our solder bath checked and no impurit

Need Help for CCGA Rework

Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article

myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .

Cover tape tearing

Electronics Forum | Thu Dec 15 19:43:33 EST 2005 | Liza

Stefan - We are using an automatic sealing equipment and have several controls also. The particular machines used for processing these products could be narrowed down to 5 machines at most. The sealing temp, pressure and dwell time are checked on a

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ

Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24

SPC for Wave solder (defects on PCB's)

Electronics Forum | Wed Feb 15 13:44:34 EST 2006 | samir

Bingo! In my career, I've used Wave Solder optimizer and the WaveRIDER. Pro's and Con's to both. I did a GR&R on both as well, and WaveRIDER came out on top. The main challenge is to get the operators to use it. I've found that the operators wer

Flux Residues In Lead Free Wave Soldeing Process

Electronics Forum | Tue May 09 21:53:06 EDT 2006 | KEN

What is your flux delivery system? Tell us a little more....please. I'm assuming ultrasonic. You can try to vary your air knife but if your pin / hole ratios are wrong then it may not help. Run a bare fab. If your problem goes away you may need to

Voiding Control on AuSn preform reflow process

Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca

I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1

Blowholes during wave soldering

Electronics Forum | Mon Sep 03 09:48:12 EDT 2007 | davef

Joris We don�t know the maximum period to store the boards without having problems with blowholes. Too many variables to determine. We prefer to just fix the problem, but understand that you have stock that you need to build-down. Determining mois


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