Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Electronics Forum | Wed Aug 27 14:19:40 EDT 2008 | grics
Have you given this information to your paste manufacturer???(Profile, Pics of defects?) The profile seems to look ok(without knowing paste info...) I think the ramprate looks a little aggressive but it could be the scaling of the profile and the i
Electronics Forum | Fri Oct 23 08:24:52 EDT 2009 | rgduval
Eric, I haven't used this oven; but, our Heller has built in profiling. Essentially, attach the thermo-couples to a board, and the appropriate point on the oven, and run a board (without parts). Your paste manufacturer will have published a reco
Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Fri Nov 06 12:15:19 EST 2015 | derrikf
Also, for anyone who's taken an interest in this thread: We just received samples of Henkel/Loctite's room temperature stable(yes, you read that right), halide-free, lead-free pastes, both the GC 10 and the GC 3W (which is a water soluble/wash paste
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Fri Oct 06 05:56:37 EDT 2000 | Alberto Silva
Hi, Instead of using High Temp solder, I would like to use a UV epoxy to atach termocouples to reflow profile boards. Does any one know a good one? Thanks in advance. Alberto
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
