Electronics Forum: size (Page 209 of 349)

Help understanding something about stencil orientation when printing

Electronics Forum | Wed Nov 09 04:16:14 EST 2016 | lachrymal

Hi MPMENG, Thanks for you reply. I must say I am printing onto wafers& I'm still somewhat new to the process but much of the theory is the same as for PCB. I trialled it in the mean time and I did find that printing into the long side of the pad wa

MYDATA - how to forse parts on Hydra head

Electronics Forum | Thu Dec 15 11:28:45 EST 2016 | huske

Depends on the size of the elec cap and the nozzle set you have. But if you can pick it up, the wrinkle on the top of the cap can be a PIA. All you need to do is make sure the cap is being taken over the line-scan/hydra camera to center only (no mec

SMD Spring Pins Reflow Crooked / Tilted

Electronics Forum | Mon Jan 09 14:18:51 EST 2017 | ttheis

Thanks for your replies. Customer designed this so we can offer them feedback on the design. Pin manufacturer said most likely too much paste as well. Reducing apeture size would be the easiest solution there. We are running a VIP70 oven with chain r

Seeking CAD2CAD software for creating VIOS TXT FILES

Electronics Forum | Sat Mar 25 16:57:30 EDT 2017 | zippi

Hi, Our Company write a new software to Convert p&p files to assembleon text or xml file. We use it with an Ellipse 2, topaz X and an OPAL XII. You can check all positions compare with Gerber, set database number and compare component size, set fidu

Conformal coat material dispensed through epoxy needle?

Electronics Forum | Fri Feb 03 17:14:49 EST 2017 | westshoredesign

You should have no problem. We use a very dated Asymtek machine (Automove 303) retrofitted for dispensing, air over syringe. It took time and some tinkering with. But all things considered, we're able to achieve remarkable results. I would recommend

problems picking up PANASONIC ERJ-12ZYJ203U resister.

Electronics Forum | Fri Feb 03 10:34:09 EST 2017 | prdmm1

PANASONIC ERJ-12ZYJ203U i am having a lot of problems picking this resistor up. i have purchased a new tool per engineering (NOT the problem). it seems the my9 is picking up then dropping it. then the machine goes to pick another and picks the dropp

Average consumption soldering paste per sqm?

Electronics Forum | Mon Mar 13 13:01:08 EDT 2017 | emeto

Very interesting, how you can answer that with that many details that you gave us. Here are some preliminary questions, before anybody can give you any answer: Pb or Pb-free? 3mil stencil or 8mil stencil? How many shifts? Quantity will depend also o

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 08:47:50 EDT 2017 | emeto

From what I know, you should follow IPC standard for the class assembly that you are building. From your post somebody mentioned something somewhere - doesn't make it official information. I would not be worried about having voids, but what is their

COMPONENT DROP DURING SECOND SIDE REFLOW

Electronics Forum | Thu Aug 24 23:20:22 EDT 2017 | micropak

We often do double sided SMT assembly, never had issues with smaller components. However, we apply glue to heavier components like inductors, SD card sockets etc. For this purpose, we have a glue dispensing machine inline after the solder paste prin

Reflow Oven Specifications Check Items

Electronics Forum | Wed Feb 14 16:44:01 EST 2018 | cbart

Probably to late for ya, but: -Center support -mesh belt and conveyor (have the mesh is nice for 1st side runs to keep the board flat. -N2 capable, in case you need it -on board profiling -smema if needed -board drop detect (sensor at input and exit)


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