Electronics Forum | Wed Jul 29 12:58:35 EDT 2015 | pankyb1261
Is there anyone that makes a pick and place glue dot for surface mount chip components (B stage epoxy dot in a carrier tape)? Thanks, Rich
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Mon Jan 15 15:33:41 EST 2001 | davef
First, we have never repackage devices, as you propose. Our schedule has us standing at Receiving like panting dogs waiting for the material required to jump the job, much less giving up the time and money to have parts repackaged. Second, fabricat
Electronics Forum | Wed Dec 10 18:47:28 EST 2003 | Rob Sierra
Hi James, Mag-D Electronics in Los Angeles ALSO carries ALL Tape Splicer tools and tapes. You can reach Mag-D Electronics at 818-762-0058 or http://www.magdelectronics.com. We also carry Adhesive Back Die Carrier Tapes and Feeders.
Electronics Forum | Sat Jul 17 10:04:39 EDT 2004 | stefwitt
I think we should shift this issue to the machine suppliers, requesting changes in the machine design, in order to keep at least the jobs of high mix, low volume in this country. We can only compete with low labor cost countries by increasing the lev
Electronics Forum | Fri Apr 23 17:44:50 EDT 1999 | Stefan Witte
| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Fri Jan 22 15:48:14 EST 1999 | Chrys
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
.gif)
