Industry News: failure (Page 3 of 122)

SMTA Announces Upcoming Webinars

Industry News | 2010-02-18 21:26:02.0

Minneapolis, MN - The SMTA is pleased to announce several new webinars coming up in March. Webinars are 60 to 90 minute online presentations comparable to a conference session. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference Announced

Industry News | 2017-08-26 20:18:39.0

SMTA and SMART Group are excited to announce plans to co-organize the Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.

Surface Mount Technology Association (SMTA)

LED A.R.T. Symposium Program Announced

Industry News | 2017-09-18 14:36:13.0

CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium held at the Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 - November 30, 2017.

Surface Mount Technology Association (SMTA)

15th Annual Pan Pacific Microelectronics Symposium Registration Open and Program Announced

Industry News | 2009-11-15 00:00:16.0

Minneapolis, MN - Registration is now open and the program is finalized for the 15th Annual Pan Pacific Microelectronics Symposium & Exhibit taking place January 26-28, 2010 at the Sheraton Kauai Resort on Kauai, Hawaii. The conference promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

Surface Mount Technology Association (SMTA)

IPC Disappointed by Failure of Negotiated Rulemaking Aimed at Encouraging Recycling of Manufacturing Byproducts

Industry News | 2017-09-18 15:09:26.0

IPC – Association Connecting Electronics Industries® is disappointed by the failure of a federal advisory committee to reach agreement on a plan to encourage recycling of manufacturing byproducts.

Association Connecting Electronics Industries (IPC)

International Conference for Electronics Enabling Technologies Program Finalized

Industry News | 2019-05-13 17:36:01.0

SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 4-6, 2019 in Markham, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Call for Participation — Deadline Extended to 2/21/20!

Industry News | 2020-02-18 14:31:52.0

Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.

Association Connecting Electronics Industries (IPC)

Electronics in Harsh Environments Conference Program Announced

Industry News | 2023-03-27 13:03:23.0

SMTA Europe is proud to announce the 2023 Electronics in Harsh Environments Conference, taking place May 23-25 in Amsterdam, Netherlands. This global conference is a three-day technical event focused on building reliable electronics used in power electronics and harsh environments.

Surface Mount Technology Association (SMTA)

When Field Failure is Not an Option — IPC Midwest Opening Session Reveals the Means to the End

Industry News | 2011-08-10 20:24:10.0

Kicking off an intense, two-day focus on the latest technologies, processes and best practices in electronics manufacturing, Jim Springer, vice president of quality at Phoenix International, will deliver the free opening session at IPC Midwest Conference & Exhibition in Schaumburg, Ill. His presentation, “Clearly Understanding Field Failures Leads to Interesting New Knowledge (CUFFLINK) - A Case Study,” will take place on September 21 at 8:00 am.

Association Connecting Electronics Industries (IPC)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)


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