Technical Library: model (Page 3 of 9)

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems

Technical Library | 2012-04-05 22:53:10.0

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob

Georgia Institute of Technology

Recurrent Neural Network-Based Stencil Cleaning Cycle Predictive Modeling

Technical Library | 2023-06-12 18:33:29.0

This paper presents a real-time predictive approach to improve solder paste stencil printing cycle decision making process in surface mount assembly lines. Stencil cleaning is a critical process that influences the quality and efficiency of printing circuit board. Stencil cleaning operation depends on various process variables, such as printing speed, printing pressure, and aperture shape. The objective of this research is to help efficiently decide stencil printing cleaning cycle by applying data-driven predictive methods. To predict the printed circuit board quality level, a recurrent neural network (RNN) is applied to obtain the printing performance for the different cleaning aging. In the prediction model, not only the previous printing performance statuses are included, but also the printing settings are used to enhance the RNN learning. The model is tested using data collected from an actual solder paste stencil printing line. Based on the predicted printing performance level, the model can help automatically identify the possible cleaning cycle in practice. The results indicate that the proposed model architecture can predictively provide accurate solder paste printing process information to decision makers and increase the quality of the stencil printing process.

Binghamton University

Optimizing the Clean-Tech Manufacturing Mix

Technical Library | 2010-02-03 14:50:51.0

This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals.

OCM Manufacturing

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Technical Library | 2012-01-12 22:51:19.0

In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi

Lamar University - Department of Mechanical Engineering

COVID-19 - Managing Supply Chain Risk and Disruption

Technical Library | 2020-06-12 00:12:13.0

Responding to the immediate challenge While COVID-19 may be the catalyst for companies to revisit their global supply chain strategy and accelerate the adoption of Digital Supply Network models and capabilities, short-term actions need to be made to respond to the immediate challenge.

Deloitte

Industry 4.0 For Inspection In The Electronics Industry

Technical Library | 2021-08-04 18:39:07.0

The digital transformation with concepts like Industry 4.0, Smart Factory and the Internet of Things will change production, work processes and business models in electronics manufacturing radically and forever. It is all about connecting, gathering and exchanging big data. It is all about connectivity, and the gathering and exchange of big data.

YXLON International

Achieving Large Scale Parallelism Through Operating System Resource Management on the Intel TFLOPS Supercomputer

Technical Library | 1999-05-07 09:58:23.0

From the point of view of an operating system, a computer is managed and optimized in terms of the application programming model and the management of system resources. For the TFLOPS system, the problem is to manage and optimize large scale parallelism. This paper looks at the management in terms of three key topics: memory management, communication, and input/output.

Intel Corporation

Closed‑Loop Recycling of Copper from Waste Printed Circuit Boards Using Bioleaching and Electrowinning Processes

Technical Library | 2021-02-04 01:56:56.0

In the present study, a model of closed-loop recycling of copper from PCBs is demonstrated, which involves the sequential application of bioleaching and electrowinning to selectively extract copper. This approach is proposed as part of the solution to resolve the challenging ... doi.org/10.1007/s12649-020-01128-9

Waste and Biomass Valorization

Siemens Asm Pickup Window 12x16 Smt Spare Parts 00322753S04 00328503

Technical Library | 2022-10-31 08:43:27.0

Model/Specification: 12*16MM Common Name: Press Cover/GUIDE Suitable Fo: Siemens Feeder Parts Material: Ceramic Wight: 55g Quality: 100% Tested High Light: 12x16 Smt Spare Parts, 00328503, 00322753S04

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00343010-01 SMT Spare Parts SIEMENS PL EA MCH Filter G1/2 Modulair 112

Technical Library | 2022-10-31 09:12:57.0

Type: Filter Cup Model: Siemens Placement Machine Certification: CE,ROHS Trademark: Siemens Brief Description: Feeder Fixing Screws Wight: 1kg High Light: 00343010-01 SMT Spare Parts, ROHS SMT Spare Parts, SIEMENS PL EA MCH Filter

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.


model searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

High Throughput Reflow Oven
See Your 2024 IPC Certification Training Schedule for Eptac

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.


"Find out how you can receive priority in SMTnet Search with out Sponsor membership."