Electronics Forum | Sun Aug 02 19:47:16 EDT 2009 | isd_jwendell
Now that I've seen the pics... Soldering could work just fine. If you are going for large production then you could get copper discs cut and mounted in tape carrier ($$). This would make it very easy for automated equipment to assemble. Mounting a
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon
| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s
Electronics Forum | Thu May 05 03:22:38 EDT 2005 | Hannu
I do not mean big, heavy transformers but rather small ferrite core transformers, with ferrites in the range of EF16 .. EF40. The weight of the lead and its percentage of the total weight is not the issue here. We simply do not want lead-containing t
Electronics Forum | Tue Nov 21 19:23:15 EST 2006 | greg york
Had exactly the same problem the other week. Baked some boards did improve slightly but not convincingly. Washed bare PCb and found excessive HASL fluids left on board from improper rinsing and problem disapeared. Baking HASL fluid out is impossible
Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Thu Apr 16 13:47:36 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Wed Apr 28 11:47:34 EDT 1999 | Frank Boyko
| | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | We are considering trying boards with White Tin solderable
Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef
Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes
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