Electronics Forum | Mon Jun 01 17:41:59 EDT 1998 | Jim Hoxie
First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part. T
Electronics Forum | Tue Jun 02 16:02:13 EDT 1998 | Earl Moon
| First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. | The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part
Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach
I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad
Electronics Forum | Tue Mar 17 08:25:57 EST 1998 | Jim Gustin
| | Maybe I'm doing something wrong, but it seems to me that The Forum takes a lot longer to open up now. It also takes a lot longer to get back to the main Forum page, after reading an individual message, and hitting the "BACK" button. What's up? I
Electronics Forum | Tue Aug 28 12:25:26 EDT 2001 | Steve
To be honest with you, it doesn't really matter how you present the data, as long as you understand what the problems are. Bottom line is who cares what the numbers are unless you are doing something about it. Are you able to track the individual de
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Thu Sep 18 15:29:59 EDT 2003 | Gabriele
Hi all, by reading along those thread (SOT23) and Tan outgassing I learned plenty of things. My first time approacing this kind of Q$A Forum, very intesting tech communication way. Any way, the path of magnetism effect was chosen when time ago we met
Electronics Forum | Fri Apr 08 09:32:09 EDT 2005 | bystrom123
We are using a low end Air vac system to place the BGA's. We have X ray we can use. Our CGA's as well use this system. They are one off parts that are above the 20K a piece range. So I have been tasked with making sure all of these procedures are the
Electronics Forum | Thu Feb 01 20:17:56 EST 2007 | daxman
I was doing a PM on our CP4-2 and decided to check the placement height of every nozzle. (we're seeing some skewed components and a lot of dropout under stn. 1) I put a dial guage under the nozzle tip at stn 7, turned placing sol on, and checked ev
Electronics Forum | Wed Feb 21 08:48:37 EST 2007 | rgduval
Ideally? Never. You risk component break down by re-running the board over the wave machine. In a perfect world, your wave operator would make adjustments after one run, and you'd run another panel over the wave to judge the effectiveness of the a
