Electronics Forum: solderability issue (Page 227 of 307)

Conathane CE 1155-35 Conformal Coating Issues

Electronics Forum | Tue Sep 27 08:22:27 EDT 2005 | Amol

I am using masking tape, the 3M high temp blue masking tape. the problem though doesnt seem to be related to the masking tap as i am seeing pin holes and eventual dewets over entire ckt board (its almost as if the board has chickenpox under black lig

Need Help for CCGA Rework

Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu

We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Sun Nov 20 04:40:12 EST 2005 | KEN

I agree with Davef. If no evidence of gouging or pad damage exists thn I would suspect supplier issue. An easy test would be to load the hole with part and thermocouple and find out what your irons are capable of delivering. Unless you're solderin

Vectra password

Electronics Forum | Tue Jan 17 17:28:47 EST 2006 | mrduckmann2000

Adlsmt, We had an issue where an Engineer setuo his own passwords on our machine, he was then laided off and nobody knew the passwords. Electrovert gave us the following passwords to try: Electrovert Wave Solder Logon Id Supervisor Password Pass

Full IR Reflow versus conventional convection ?

Electronics Forum | Mon Jan 23 03:17:10 EST 2006 | pavel_murtishev

Good morning, IR reflow is yesterday technology. IR heating principle has a lot of issues with heat transfer capability (shadow effect) and uneven PCB heating. To avoid this forced convection ovens were developed. Reflow oven for SMD soldering must

Any suggestion on snap on EMI sheilding?

Electronics Forum | Fri Oct 06 12:58:07 EDT 2006 | cw

hi All, Anyone use snap on type EMI sheilding before? I would like to provide a DFM to a customer who currently have a EMI shield soldered on the boards, which i found this not quite manufacturing friendly as it block the view for inspection, plus re

PB FREE WASH AND MATERIAL HANDLING

Electronics Forum | Mon Feb 27 17:08:08 EST 2006 | barryg

we here are setting up our lead free process. Was curious about how others handle these issues. 1) Do you physicaly segregate leaded from non-leaded (different storage areas, shelving) for part storage? 2)Do you have a seperate board washer just for

Solder Paste

Electronics Forum | Fri Feb 16 11:37:58 EST 2007 | hectorsmtnet

I have been using the Loctite Multicore WS200 with great results for the last two years. We also use the lead free version WS300. I like the flux chemistry (which is the same for both products); it really withstands long soaking times and with very g

Solder Saver ??

Electronics Forum | Mon Apr 17 14:08:51 EDT 2006 | russ

So far the only issue I have been able to determine with this product is Pkaymetals the company. Seems impossible to get samples or local representation. Was told first that they would not let me have it until they had local representation so equip

Blistering issue, mixed LF/SnPb process

Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef

Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue


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