Electronics Forum | Wed Feb 23 21:23:56 EST 2000 | Larry Johnson
Does anyone know where I can find something in writting on the proper ways to clean a mis-printed board using no-clean solder paste? If not, can any of you tell me what the best way is? Currently, we are running mis-printed boards though the Aqueou
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Tue Feb 22 14:31:20 EST 2000 | JAX
If you are not placing any parts that need special attention ( BGA, CCGA, etc... ) on topside then it should be fairly easy to create a profile that will work for you. If you are wanting to use the profile you currently have for topside I am not sur
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Thu Feb 24 14:03:59 EST 2000 | John Cudmore
Brian, The SRT FPD-W is an older unit that has been successful for a long time. We have used it at BEST with good results. The SRT FPD-W is a very good machine for the uses you mentioned except possibly for the BGAs. I have seen some used for BGA
Electronics Forum | Tue Feb 15 14:25:08 EST 2000 | Sergey
Dear Sirs Good business day! I need the following feeders for CSM60 machine: - Stick feeders: 1. 20 mm x 1 2. 13 mm x 3 3. 8mm x 7 - Tape feeders: 1. 16 mm, 9" x 7 you seems to be have not this 2. 24 mm, 9" x 3 3. 32mm, 9" x 1 - Manual tray feeder
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira
We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche
Electronics Forum | Fri Dec 15 05:54:05 EST 2000 | Wolfgang Busko
Great Dave !!! What would we do without you ? I�ve never seen someone with that much broad knowledge in our field and the will to share it. Your Karma-point score must be one of the highest. I want to thank you (I think in the name of all here) and
Electronics Forum | Wed Dec 13 18:41:33 EST 2000 | Steve A
Chris, I am not a chemist, but my best guess would be that you were able to remove some of the solvents from the paste flux without exhausting too much of the activators. The loss of solvents could have cut down on violent boiling (violent boiling
