Electronics Forum | Tue Jul 18 18:53:23 EDT 2006 | Mike F
Is it showing up after wave or reflow soldering, or after hand soldering? If the delamination or blister bridges between traces you have the potential for a short circuit between those traces. A delamination might be repairable, but in most cases i
Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt
Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr
Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech
Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the
Electronics Forum | Wed Jul 08 20:57:11 EDT 1998 | hyeon-jin Kim
I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. After reflow soldering, we have often "blister phenomenon". Our reflow profile is normal. Factory conditio
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Mon Jun 28 22:30:06 EDT 2004 | davef
If you find it at the end of your process and you find no defects, work on something else. Now if you are a smooth talker and seek a little adventure in life, you might be able to finesse this thing into a road trip to take a tour of your board fa
Electronics Forum | Fri Jul 28 08:46:36 EDT 2006 | davef
Two lines of thought are: * That you have some solder connections points us towards components. It seems like the solderability protection on some components need to have the reflothermal recipe tailored for that component. * Paste selection is a BI
Electronics Forum | Fri Jul 28 08:51:50 EDT 2006 | russ
Are all these defects related to the trace that enters pad? Looking at #2, the good fillet has side trace entry and the bad has front entry. I would suggest that a profile check is in order, then the paste would be next culprit. Russ
