New Equipment | Test Equipment
Mechanical& Electronical Specification Pitch 1.27mm[ 0.050in] Working Stroke 4.25mm[ 0.167in] Full Stroke 6.35mm[ 0.250in] Spring Force 1N 1.5N Resistance Max.50mOhm Current
Terminals Harwin Terminals are useful for a variety of connection styles and location requirements. Choice of turned and blade designs. Solder and wire-wrap location points. Test points. Single male contact for use with applicable
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
New Equipment | Industrial Automation
♦Skype : dddemi33 ♦Sales Manager : Tiffany Guan ♦QQ :2851195473 ♦Whats@app : +86 18030235313 ♦RFQ e-mail : plcsale@mooreplc.com Control Systems (DCS, PLC/SPS, CNC) - Panel Control
New Equipment | Industrial Automation
♦Skype : dddemi33 ♦Sales Manager : Tiffany Guan ♦QQ :2851195473 ♦Whats@app : +86 18030235313 ♦RFQ e-mail : plcsale@mooreplc.com Control Systems (DCS, PLC/SPS, CNC) - Panel Control
New Equipment | Industrial Automation
♦Skype : dddemi33 ♦Sales Manager : Tiffany Guan ♦QQ :2851195473 ♦Whats@app : +86 18030235313 ♦RFQ e-mail : plcsale@mooreplc.com Control Systems (DCS, PLC/SPS, CNC) - Panel Control
New Equipment | Test Equipment
Sand and Dust test chambers simulate dust and sand climate condition to evaluate the effects on products in dust-filled environment, the purpose is to test product sealing performance. Dust test chambers are applied in home appliance enclosure, elect
We work as an integrated extension of your manufacturing department in assembling surface mount and thru hole assemblies. On consignment basis or turn key, we will do our best to meet our manufacturing deadlines and ship JIT (Just In Time). When Qu
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
New Equipment | Wave Soldering
For selective thru-hole components soldering on PCBs made in mixed technology http://www.selen.hr/pokaz_kategorie.php?cid=62
