Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2013-01-16 11:21:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2003-01-28 10:29:13.0
Conducted by Wall Street Audio, with Iehab Hawatmeh, President & CEO
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2019-02-11 19:44:42.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on January 28 and January 30 at IPC APEX EXPO 2019 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2013-09-17 17:28:51.0
Industry thought leaders will present a high-level look at new technologies against a backdrop of domestic and global economics during the IPC Technology Market Research Conference (TMRC), September 25–26 in Chicago.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2013-08-13 15:23:39.0
Experts from industry giants, government and academia will take center stage September 25–26 at the IPC Technology Market Research Conference (TMRC) in Chicago.
Industry News | 2022-12-26 11:44:31.0
The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.