Electronics Forum | Thu Jan 22 09:04:22 EST 2009 | mefloump
Humiseal recommends a 1 to 1 mix ratio of 1B31 and Thinner 521. I have for that I need to thin my ratio more to get humiseal to spray correctly in our PVA650. Also I am using Humiseal 1B73 but the tech data sheets say the same for spraying. Try thinn
Electronics Forum | Wed Sep 02 11:36:22 EDT 2009 | kpm135
Is this an established process that is just now exhibiting these problems, or is this a brand new process you're just setting up? What is the rest of your process like? What is done to the boards before you coat them? Water washed? Solvent washed? Sa
Electronics Forum | Tue Sep 20 09:07:23 EDT 2016 | davef
5 Common Causes of Bubbles in Conformal Coating (and Their Remedies)[Diamond-MT's Blog]
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Fri Aug 28 08:52:13 EDT 2009 | duso02
Yes, you must thin Dow CC for any spray operations. We use Dow 2577 daily for multiple customers and we always thin it for spray operations and 2577 is considered medium viscosity. Dow recommends using up to 60% solvent (Xylene). Your 2620 is low vis
Electronics Forum | Tue Sep 20 05:21:41 EDT 2016 | abhilash4788
Hi, Currently we are facing bubble formation in conformal coatings in the pcba. Have varied various specs of the conformal coating machine, even during manual application also having the same issue. the material used is silicone conformal coating. N
Electronics Forum | Mon Jun 17 13:07:11 EDT 2002 | Robert Hartmann
Can anyone point me to a specification or paper describing the existance of voids in transfer mold epoxies during CSP assembly? We have found very small bubbles in our process, but cannot find any information as to whether this is acceptable, and if
Electronics Forum | Mon Mar 27 21:09:29 EST 2006 | ms
Thanks Dave I'm not convinced the air is necessarily in the paste from manufacture - suspicious that it may be folding in during the change in direction of the print cycle - or as the paste travels across apertures. It is not necessarily in the fir
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Wed Nov 06 10:17:45 EST 2002 | davef
In order from best, better, good * Lowest purchase price: cartridge, jar, syringe * Ease of inventory control: cartridge, jar, syringe * Flexibility of use: jar, syringe, cartridge * Ability to dispense by hand or machine: syringe * Cost to get paste
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