Electronics Forum: enig and explosion (Page 3 of 4)

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia

Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Wed Apr 06 12:21:14 EDT 2011 | ripper

Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.

Criteria for Min Thickness regarding Large and Small pads

Electronics Forum | Sun Jun 29 15:03:04 EDT 2008 | jensteele

I was referring to the HASL supplied by the supplier...specifically Lead Free HASL. I've been searching the web and I cannot find a thickness specification like we have for ENIG and Immersion Silver.

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko

Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Thu Apr 07 02:38:20 EDT 2011 | aungthura

I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfor

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Thu Apr 07 09:04:19 EDT 2011 | mosborne1

First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture.

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22

Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb


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