Industry News | 2015-10-18 20:03:37.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla.
Industry News | 2012-06-25 12:38:27.0
Seika Machinery, Inc. announces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline
Industry News | 2012-06-28 21:14:17.0
Seika Machinery, Incannounces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline. Effective June 25-July 27, 2012, Seika Machinery is offering a special discount on McDry MC-1001 and MC-1002 PCB Storage Cabinets.
Industry News | 2012-02-15 03:10:09.0
In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.
Industry News | 2012-02-15 21:13:52.0
In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.
Industry News | 2016-08-31 19:08:27.0
PDR Americas announced today that it will exhibit at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase its best-selling PDR Model E3Vi Gold and offer several show specials in Booth #202. Additionally, PDR will hold a drawing for a portable Coleman BBQ grill (Roadtrip LXE). Show specials include:
Industry News | 2013-03-22 11:10:14.0
CyberOptics Corporation (Nasdaq: CYBE) will present its newest range of SPI and AOI inspection solutions in its representative HumanTek’s booth E-125 in Hall C at SMT/PCB & NEPCON Korea, scheduled to take place April 3-5, 2013 at the Coex Convention & Exhibition Center in Seoul, South Korea.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
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