Electronics Forum | Wed Feb 03 16:45:20 EST 1999 | Mark Henebry
Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connector
Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Wed Feb 03 18:36:47 EST 1999 | Earl Moon
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Mon Jan 25 21:43:04 EST 1999 | Dave F
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Mon Sep 23 12:42:15 EDT 2002 | dragonslayr
yea - yippie- Scott's the man!!!! good answer - I support the notion that in the long run, stopping the line, getting the root cause determination, is not only effective but efficient. It is hard to do because we all are so used to fire fighting on
Electronics Forum | Sun Jan 31 23:03:57 EST 1999 | Dennis O.
| | hi, | | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier pr
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Mon Jun 18 04:21:22 EDT 2012 | brettrenishaw
Measured the pot temprature independantly from the software (268C/514F from moving wave). We are using Dross Inhibiter Tin/P Regenerator from BLT. Monthly sample checks are carried out on the solder bath and are all within limits. It will be hard to
