| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
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"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Heller-Frost-and-Sullivan-2013-Award.pdf
leads in terms of open collaboration with customers. It has opened applications lab in China, Korea, and in the United States with a clean room facility. Through this partnership, Heller assists customers with application problems related to soldering
Heller Industries Inc. | http://hellerindustries.com/wp-content/uploads/2022/04/Heller-Frost-and-Sullivan-2013-Award.pdf
leads in terms of open collaboration with customers. It has opened applications lab in China, Korea, and in the United States with a clean room facility. Through this partnership, Heller assists customers with application problems related to soldering
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Heller-Frost-and-Sullivan-2013-Award.pdf
leads in terms of open collaboration with customers. It has opened applications lab in China, Korea, and in the United States with a clean room facility. Through this partnership, Heller assists customers with application problems related to soldering
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
