Electronics Forum | Wed Jun 06 10:59:43 EDT 2001 | wbu
It�s hard to tell you one good profile for a specific machine cause profiles are mainly dependent on the specific assembly you want to rework. My aproach to this problem is trying to get a close as possible profile as under normal reflow conditions u
Electronics Forum | Wed Jun 06 09:09:28 EDT 2001 | nwyatt
Help! I have been assigned to take over our current rework machine because the profiles have been changed so often and by so many people that they are now not working consistantly. Nobody has been supporting it for the past 2 years and now I have b
Electronics Forum | Fri Aug 27 11:57:49 EDT 2004 | Dreamsniper
REFLOW SOLDERING PROCESSES AND TROUBLESHOOTING: SMT, BGA, CSP AND FLIP CHIP TECHNOLOGIES By Ning Checng Lee http://www.argospress.com/Resources/business/book-0750672188.htm regards,
Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
Electronics Forum | Thu Jul 15 12:09:10 EDT 2010 | wrongway
if the BGA has leaded balls use leaded paste if the BGA has lead free balls use lead free paste and set your oven profile to match the paste
Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Thu May 08 08:07:24 EDT 2008 | tazzntigger
I am with Rwyman. This "hybrid" profile is also used for reworking the BGA's.
Electronics Forum | Fri Apr 14 17:25:53 EDT 2006 | davef
As from previous discussions on this topic here on SMTnet, we are perfectly comfotable using leadfree component solderability protection on components with leaded solder, except BGA. Consider balling your BGA to be leaded.
Electronics Forum | Fri Jun 15 12:08:49 EDT 2007 | ck_the_flip
Hi Grant, 1st off solder paste data sheets are just "guidelines". You always need to set your specs. based on the needs of your own process and product. Don't ever follow your solder-paste data sheet to the tee, or you're severely limiting yoursel
