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Advanced Packaging Technology

Technical Library | 2019-10-16 10:20:25.0

A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.

ACI Technologies, Inc.

Juki Metal Black SMT Spare Parts , Standard JUKI IC Tray Holder 330X310

Juki Metal Black SMT Spare Parts , Standard JUKI IC Tray Holder 330X310

Parts & Supplies | Assembly Accessories

Detailed Product Description Original: China Name: IC Tray Holder Conditon: Brand New Brand: JUKI Material: Metal Stocks: Yes Metal Black SMT Spare Parts , Standard JUKI IC Tray Holder 330X310​ Description: 1, Original Place: China 2, P

KingFei SMT Tech

Juki nozzle shaft/nozzle holder

Juki nozzle shaft/nozzle holder

Parts & Supplies | Component Packaging

JUKI nozzle shaft/nozzle holder original new and used,copy new three choices all have quality guarantee JUKI nozzle shaft/nozzle holder JUKI 750 E30067250A0 Z SLIDER SHAFT ASM JUKI 2050 40001137 S HOUSING ASM JUKI 2050 40001140 BA

Jinchen Electric Technology Co,.Ltd

Siemens Nozzle Siemens 701/901 Nozzle Ceramic Material 00327810-08

Siemens Nozzle Siemens 701/901 Nozzle Ceramic Material 00327810-08

Parts & Supplies | Component Packaging

Other models available: Siemens Nozzle 711/911 Siemens Nozzle 714/914 Siemens Nozzle 715/915 Siemens Nozzle 717/917 Siemens Nozzle 718/918 Siemens Nozzle 719/919 Siemens Nozzle 737/937 Siemens Nozzle 738/938 Siemens Nozzle 739/939 Siemens N

Jinchen Electric Technology Co,.Ltd

Siemens Nozzle Siemens 704/904 SMT Nozzle P/N 00322602-06

Siemens Nozzle Siemens 704/904 SMT Nozzle P/N 00322602-06

Parts & Supplies | Component Packaging

Other models available: Siemens Nozzle 711/911 Siemens Nozzle 714/914 Siemens Nozzle 715/915 Siemens Nozzle 717/917 Siemens Nozzle 718/918 Siemens Nozzle 719/919 Siemens Nozzle 737/937 Siemens Nozzle 738/938 Siemens Nozzle 739/939 Siemens N

Jinchen Electric Technology Co,.Ltd

Juki SMT nozzle shaft

Juki SMT nozzle shaft

Parts & Supplies | Component Packaging

We supply full range of nozzle shaft for JUKI chip shooter.Just tell us the model name & part number.We can always find what you need in few seconds.No matter the latest or the obsolete,used or new.All the preowned shaft for sale refurbished,excellen

Jinchen Electric Technology Co,.Ltd

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Industry News | 2011-08-15 12:43:52.0

The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2017-08-29 15:41:30.0

The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Juki SMT Spare Parts JUKI IC Feeder Tray Holder for 700 and 2000 series

Juki SMT Spare Parts JUKI IC Feeder Tray Holder for 700 and 2000 series

Parts & Supplies | Pick and Place/Feeders

Metal Black SMT Spare Parts , Standard JUKI IC Tray Holder 330X310​ Description: 1, Original Place: China 2, Part name Name: IC Tray 3, Size: 330X310 4, Weight: 4KG 5, packaging: Original Pack 6, MOQ: 1 piece 7, Used for JUKI Brand P

Jinchen Electric Technology Co,.Ltd

International Wafer-Level Packaging Conference and Exhibition

Industry News | 2011-01-18 14:37:31.0

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

Surface Mount Technology Association (SMTA)


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