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The Industry Loses an Icon

Industry News | 2009-12-03 22:49:57.0

Gene F. Wakefield Passed away on November 29, 2009 after a courageous battle with pancreatic cancer. He was born on December 22, 1933 in Albuquerque, New Mexico. He is survived by his wife, LaJuana. He leaves behind a daughter, Marvel Wakefield (Los Angeles, CA), two brothers, John Wakefield (Crawford, CO) and Roy Wakefield (Truckee, CA), three sisters, Lila Craig (Colorado Springs, CO), Mary Alyce Krist (Ft. Collins, CO) and Margaret Ann Foss (Buffalo, WY).

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AutoTRAX EDA Ltd. Appoints John Shotsky, Former Orcad Product Manager, as EDA Tools Product Manager

Industry News | 2003-02-04 08:49:40.0

John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001

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CirTran Further Expands Domestic Sales Capacity to Over 40 Representatives

Industry News | 2003-03-12 08:14:19.0

Today announced the addition of two leading electronics sales representative firms designed to increase CirTran's domestic sales volume.

SMTnet

Titan General Holdings, Inc Reconstitutes Board of Directors

Industry News | 2003-05-09 08:35:07.0

Bringing the board experience more in line with its business objectives

SMTnet

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

REMEC Deploys AWR Design Flow Worldwide

Industry News | 2003-06-09 09:16:38.0

The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.

SMTnet

The Electronics Industry Loses a Consummate Professional

Industry News | 2009-09-26 15:37:45.0

Barry O’Brien died on Sunday, September 20, 2009 while bike riding. Barry covered the Ohio territory for Horizon Sales, a manufacturer’s representative corporation supplying machinery and supplies to the electronics industry.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Altium Unveils New �Board-on-Chip� Technology

Industry News | 2003-04-30 08:37:19.0

Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs

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2011 Universal Instruments Genesis II GC-60D

2011 Universal Instruments Genesis II GC-60D

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2011 Universal Pick & Place Genesis II GC-60D

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