Full Site - : non eutectic (Page 3 of 8)

BGA opens / cracks

Electronics Forum | Sun Feb 04 15:06:20 EST 2007 | Scotty

Profile should have a longer cool soak. Verify as was mentioned all pin/fixture support through out the entire process. Print, Place, pre reflow hand load, post reflow, carriers, ICT, Depanel and FCT. Conformal Coated or Potted? Mylars work well for

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken

I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x

Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp

Solder Ball Dispersion Test (String Solder)

Electronics Forum | Fri May 04 16:19:52 EDT 2018 | solderingpro

meaning its non-eutectic. You would want to stay as close to 350°C as possible or (if a slightly off version of SAC305) target the highest melting point of your chemistry) - assuming your temp controller is properly calibrated that is. Other option

Re: 63/37 vs 65/35 solder

Electronics Forum | Tue Jul 27 13:14:36 EDT 1999 | Bill Bannister

| | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | I understand 63/37 to be pre

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Re: 63/37 vs 65/35 solder

Electronics Forum | Tue Jul 27 10:37:47 EDT 1999 | John Thorup

| We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | I understand 63/37 to be pretty

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel

Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder

Re: 63/37 vs 65/35 solder

Electronics Forum | Tue Jul 27 14:09:51 EDT 1999 | JohnW

| | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | I understand 63/37 to be

Re: 63/37 vs 65/35 solder

Electronics Forum | Thu Jul 29 19:30:44 EDT 1999 | Boca

| | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | I understand 63/37 to be


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