Industry News: solder and ball and gap (Page 3 of 16)

Volunteers Honored for Contributions to IPC and the Electronics Industry at IPC APEX EXPO 2020

Industry News | 2020-02-18 15:10:01.0

IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Fifty Professional Development Courses at IPC APEX EXPO 2013 Go Beyond Theory with Practical Solutions and Best Practices

Industry News | 2012-11-13 09:35:09.0

Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Industry and IPC More than 140 Awards Presented at IPC APEX EXPO

Industry News | 2013-02-20 18:54:10.0

IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Tech Symposium on SMT Micro Electronics Assembly and Rework

Industry News | 2015-08-03 17:18:00.0

Join BEST and 50+ engineers on October 1 in this technical symposium featuring excellent speakers and topics

BEST Inc.

Tech Symposium on SMT Micro Electronics Assembly and Rework

Industry News | 2015-08-05 10:32:21.0

SMT micro electronics assembly and rework symposium has been scheduled for 2015 for October 1, 2015. Learn/Re-learn how to perform a design of experiments, learn rework tips from Paul Wood and "lessons learned" from Chrys Shea.

BEST Inc.

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:00:40.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:01:00.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

KIC releases new smart technology for real-time insight into reflow and wave solder processes

Industry News | 2017-10-12 15:05:21.0

KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all relevant data.

KIC Thermal


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