Electronics Forum | Fri Aug 12 17:36:06 EDT 2011 | grics
Dave is correct. Also, you should check the TDS's of the caps and the display before processing to see if they can withstand the process temps, look for a recommended solder profile or info for the manufacturability of the device. On another note,
Electronics Forum | Sat Aug 13 10:56:57 EDT 2011 | jldowsey
Process Flow #4 in davef's response is your best bet for this assemblly judging buy your pictures. We purchase our selective wave solder pallets from Ascentec Engineering - they can fabricate a pallet to hold your assemblies, keep the SMT devices pro
Electronics Forum | Mon Mar 26 07:38:26 EDT 2007 | davef
The temperature that will melt solder holding top side SMT components during wave soldering depends on the alloy of that solder. So, for example, you'd expect: * Near eutectic SnPb solder to melt around 215*C. * LF to melt around 240*C. It's common
Electronics Forum | Mon Mar 26 02:09:35 EDT 2007 | Amy
Anyone knows about the top side remelting requirement for wave soldering process? Is there any standard & procedure to follow? What temp can cause the solder for top side to re-melt?
Electronics Forum | Thu May 16 15:37:45 EDT 2002 | Hussman69
I fit you in where you work!
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Tue Sep 04 11:26:12 EDT 2001 | Jean Michel
During the solderin of a double side board, how can I calculate the maximum weight of a component I can put in the first side to avoid the component fall down in the oven (depending on the soler join surface) ? Are there some rules ?
Electronics Forum | Tue Sep 04 18:11:18 EDT 2001 | davef
Assuming you're asking about double sided reflow soldering ... Use pad mating to lead wetting area. Bob Willis has found the ratio to be as much as 44 grams/sq in. Check Bob's site [Electronic Presentation Sevices] for more. Phil Zarro uses the
Electronics Forum | Mon Sep 10 11:10:30 EDT 2001 | jmlasserre
Dave, Thanks for your quick answer, I read some paper on the forum. I would like to learn more and to know how to obtain the result of x gr / sq in (mathematic methode). Do you know where can I found it ? Thanks. J Michel
Electronics Forum | Wed Mar 14 17:33:42 EST 2001 | davef
Check Bob Willis' site. He calls this Single Side Multipass Endothermic Elongated Happy Reflow Soldering, er someting like that. Ha ha ha!!! Naw, he calls it Simultaneous Double-Sided Reflow Soldering. That might be something like you are talking
