| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
in 1999 and revised in July 2002. Top Ten Issues and Misconceptions Associated with MSD Control Moisture sensitive devices are a serious assembly issue that requires a high level of control
| https://www.eptac.com/faqs/ask-helena-leo/page/3
& Leo Have a technical question? Dealing with a process or standards issue and not sure where to turn? *Helena and Leo, our technical experts, are here to help
Surface Mount Technology Association (SMTA) | https://www.smta.org/board_of_directors/criteria.cfm
. Although the SMTA Board is charged with policy development and the governance of the organization, there will be times when your special expertise can contribute to a specific issue or program, and
| https://www.eptac.com/3-strategies-for-effective-rework-repair-of-pcbs/
. A lack of proper storage, packaging, and handling can lead to contamination, physical damage, solderability degradation and moisture uptake
| https://www.eptac.com/blog/3-strategies-for-effective-rework-repair-of-pcbs
. A lack of proper storage, packaging, and handling can lead to contamination, physical damage, solderability degradation and moisture uptake
& Leo Have a technical question? Dealing with a process or standards issue and not sure where to turn? *Helena and Leo, our technical experts are here to help
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal-review-process.cfm
, including microsystems, emerging technologies, and related business operations. Committee Mission Statement The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
) than the leaded products they replaced. However, one issue did escape this qualification process. Over time it was discovered by Dell [8] and others [9, 10, 14
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
+ Improved die attach alloys that achieve high reliability in power electronic devices exposed to harsh environments are needed. Suresh Telu will present the use of micro-alloying additives that modify bulk allow properties, solderability and solder joint strength
