Full Site - : solderability shelf life of tin (Page 3 of 15)

Dow Corning Electronics Distributor of the Year awarded to Krayden, Inc. in Recognition Ceremony

Industry News | 2010-07-16 16:12:26.0

Krayden, Inc., a leading distributor of engineered materials, announces that it received the Dow Corning Electronics 2009 Distributor of the Year award during a ceremony that was held on May 19, 2010 at its headquarters in Denver. This is the second consecutive year Krayden, Inc. has earned this award.

Krayden Inc.

Effect of Silver in Common Lead-Free Alloys

Technical Library | 2023-01-02 17:50:34.0

Silver bearing alloys have been used in electronics soldering for many years. Silver has been used in tin-lead solders (Sn62Pb36Ag2) to combat silver scavenging from silver plated electronic components as well as to improve thermal fatigue resistance. Many of the common lead-free alloys contain some amount of silver. Silver bearing alloys have good electrical and thermal conductivity as well as the ability to wet to the common surface finishes used in printed wiring assemblies, thus giving it all the attributes needed for an electronic solder alloy. Presence of silver in Sn based solders increases the bulk solder modulus and is generally believed to improve resistance to fatigue from thermal cycles. Increased solder modulus can be advantageous or disadvantageous depending on the desired performance attribute. For example in high strain rate situations, higher modulus of the bulk solders results in lower life time. A wide variety of leaded and lead-free

Cookson Electronics Assembly Materials

Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at APEX 2008

Industry News | 2008-03-15 15:22:12.0

OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.

Nihon Superior Co., Ltd.

Krayden Named Distributor of the Year for Electronics in 2013 North America

Industry News | 2014-05-05 17:21:00.0

Denver-April 2014-Dow Corning has named Krayden, Inc. (http://Krayden.com) as the recipient of the “Dow Corning Electronics North American Distributor of the Year 2013” for its outstanding performance in the distribution of engineered silicone materials in electronics. Krayden has been honored with this coveted and prestigious award five out of the last seven years.

Krayden Inc.

3rd Year in a Row! Dow Corning Electronics Awards Krayden Inc. as its “North America 2010 Distributor of the Year”

Industry News | 2011-02-21 17:44:33.0

Krayden, Inc., a leading distributor of engineered materials, announces that the Dow Corning Americas Electronics Channel Team named Krayden, Inc. as the recipient of the Distributor of the Year Award.

Krayden Inc.

Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009

Industry News | 2009-11-02 21:58:24.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.

Nihon Superior Co., Ltd.

Size Matters - The Effects of Solder Powder Size on Solder Paste Performance

Technical Library | 2020-10-27 02:02:17.0

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.

FCT ASSEMBLY, INC.

Keeping Tin Solderable

Technical Library | 1999-05-06 15:31:13.0

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...

TE Connectivity

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

SIPAD Systems, Inc.

SIPAD Systems, Inc.

Videos

SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi

SIPAD Systems Inc.


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