Electronics Forum: standoff (Page 3 of 27)

Routing Under Chips

Electronics Forum | Thu Jul 03 15:03:39 EDT 2003 | Jim Nunns

My design group wants to change our route keep out around all SMT parts to 5 mil even under the parts with zero standoff. Are others in the industry routing under parts that have no standoff? My fear is that we will get shorting if the mask is scaped

Cleaning Water Soluble Flux under BGA's

Electronics Forum | Thu Mar 25 15:27:01 EST 2004 | davef

Thank you Mike. What is your thinking on the use of surficants, as an alternative to saponifiers, for cleaning under low standoff parts? Dreamy: Adding another point to the low standoff part conversation: If you have cleaning issues with 1.27 BGA,

Pin in Paste with dispenser

Electronics Forum | Tue Jan 25 07:49:17 EST 2005 | davef

On "Solder beading seemed to be a problem", consider revisiting the thermal recipe used for reflow. The PTH barrel may not be getting warm enough. On "Component not being designed to pin in paste work, with no proper standoffs", consider: * Using a

MPM SPM Supplies

Electronics Forum | Fri Feb 23 08:53:52 EST 2007 | russ

Ours does not have a vacuum option so that may be it, the machine came with an assortment of standoffs and support plates as well. it is not drilled out in a grid but does have the center tapped which I assume is for the vacuum tooling. Ours has a

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef

Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an

QFN Rework

Electronics Forum | Mon Jul 21 09:57:29 EDT 2008 | davef

We use a ministencil with a QFN pattern that is very similar to the orginal stencil. Here's a link to one of the better white papers on QFN rework: http://www.intersil.com/data/tb/TB389.pdf QFN with less than a 2 thou standoff are less reliable tha

Re: VME Assemblies

Electronics Forum | Mon Apr 27 11:04:12 EDT 1998 | Dave

| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai

Re: Re: VME Assemblies

Electronics Forum | Mon Apr 27 07:37:42 EDT 1998 | Scott Davies

| | I realize this is a SMT forum, but I have another | | problem related to electronics assembly and hope there | | will be someone out there that can save my life (this | | time). | | We build quite a few VME assemblies to which we attach | | a SA

Re: VME Assemblies

Electronics Forum | Tue Apr 28 10:09:59 EDT 1998 | Scott Davies

| | Where can I find pliers to accept a round standoff? | Scott: Two ideas come to mind: | 1. change the stand-off round to to a hex shape | 2. if you must use the round shape, go to Sears, buy a "robogrip" and a pack of the platic inserts that fi

Epoxy on bottom of SMT component

Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy

Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus


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