Technical Library: wire and support (Page 3 of 4)

5 Questions to Ask Before Choosing a New Cut and Strip Machine

Technical Library | 2014-10-27 08:54:59.0

A lot of time and effort often goes into finding the right equipment for your facility. Purchasing a new wire cut & strip machine is no different. With so many options, where does one start? Asking these five questions during the decision making process will help ensure you end up with equipment that fits all of your needs.

Schleuniger, Inc.

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Technical Library | 2017-09-07 13:56:11.0

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

Teledyne DALSA

Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis

Technical Library | 2023-11-20 18:49:11.0

Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspection, not only provides a non-destructive test but also allows investigation within optically hidden areas, such as the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips). As the size of components continues to diminish, today's x-ray inspection systems must provide increased magnification, as well as better quality x-ray images to provide the necessary analytical information. This has led to a number of x-ray manufacturers offering digital x-ray inspection systems, either as standard or as an option, to satisfy these needs. This paper will review the capabilities that these digital x-ray systems offer compared to their analogue counterparts. There is also a discussion of the various types of digital x-ray systems that are available and how the use of different digital detectors influences the operational capabilities that such systems provide.

Nordson DAGE

Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards

Technical Library | 2018-11-07 20:48:01.0

Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications. We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously.

Electro Scientific Industries

Basics of ASHCROFT Pressure Transmitter - Performance Index, Wiring, Thread Type, Unavoidable Inaccuracies and Mounting

Technical Library | 2021-11-29 01:10:58.0

ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines. ASHCROFT pressure transmitter is an electronic device that senses the pressure signal and converts it into an available output electrical signal according to certain rules.

OKmarts Industrial Parts Mall

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods.

Technical Library | 2010-03-18 14:02:03.0

Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.

Trace Laboratories

Choosing the Right Cutting and Stripping Machine – It’s all about the apps

Technical Library | 2013-01-29 15:48:08.0

Choosing a new wire Cutting and Stripping (C&S) machine can be like shopping for a new car. With so many choices, where does one start? A nice, little sports car might be fun to have, but how often will it just sit there because it can’t carry a car load of kids or some odd-sized goods from the local home improvement store? You just might be better off with a midsize SUV that does a pretty good job at doing everything you need it to do.

Schleuniger, Inc.

Creep Corrosion of PWB Final Finishes: Its Cause and Prevention

Technical Library | 2021-04-08 00:30:49.0

As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion

Alcatel-Lucent

Maintenance and operation of walk-in temperature humidity test chamber

Technical Library | 2019-11-17 22:46:45.0

Overview of walk-in temperature and humidity chamber: It also belongs to environmental test equipment, it tests whether the product can resist high temperature, low temperature, humidity, or the physical and chemical changes produced under extreme conditions, the walk-in temperature and humidity chamber volume is large, the product is placed, or a large object can be placed, such as automobile, new energy, television and liquid crystal screen, etc. How to do the routine maintenance of the walk-in temperature and humidity chamber: 1. The wet gauze basically, if there is no special case, s/b usually changed once in 3 months 2. The water channel shall be regularly cleaned, including water cup, water tank, etc., so as to prevent the water from being blocked,affect the humidity test. 3. It is forbidden to test the flammable and explosive products inside working room. 4. Clean the chamber on a regular basis 2. How to operate walk-in temperature and humidity chamber: The operation method is same as standard temperature humidity test chamber,the controller is 7-inch LCD programmable color screen, you only need to setthe temperature point---test time--how many cycles need to be tested, This can be done automatically, and the machine will stop automatically when it is complete. If there is any problem during the operation, the corresponding problem point will be displayed on the machine control screen. Walk-in temperature and humidity chamber is a must equipment for reliability test of Automobile,Aerospace,Electronic parts,etc,the operation and maintenance are easy,it is teh tear down mahcine,Climatest engineers will be dispatched to do on-site support,for instance,we will finish commissioning,train customers how to operate,maintain,welcome to follow our company facebook page:https://www.facebook.com/Climatechambers

Symor Instrument Equipment Co.,Ltd

High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly

Technical Library | 2020-09-30 19:23:47.0

There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices. The applications can be lens bonding, waveguide imprinting, or other applications where the adhesive is in the optical pathway. To support these various optical applications, new materials with tailorable optical properties are required. There is often a mismatched refractive index between plastic lenses such as PC (Poly Carbonate), COP (Cyclo Olefin Polymer), COC (Cyclo Olefin Copolymer), PMMA (Poly Methyl Methacrylate), and UV curable liquid adhesive. A UV curable liquid adhesive is needed where you can alter the refractive index from 1.470 to 1.730, and maintain high optical performance as yellowness index, haze, and transmittance. This wide range of refractive index possibilities provides optimized optical design. Using particular plastic lens must consider how chemical attack is occurring during the process. Another consideration is that before the UV curable liquid adhesive is cured, chemical raw component can attack the plastic lens which then cracks and delaminates. We will also show engineering and reliability data which defined root cause and provided how optical performance is maintained under different reliability conditions.

Kyoritsu Chemical & Co., Ltd


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