Electronics Forum | Tue Mar 04 07:23:15 EST 2003 | msivigny
Hello ricardof, To implement Cpk studies on SMT production equipment, you will require highly accurate glass plates, glass component slugs, accurately manufactured stencils and a measurement system to perform X, Y and Theta positional deviations from
Electronics Forum | Sat Mar 06 13:34:04 EST 1999 | Earl Moon
| | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | Concerning the BGA stuff, I'm getting about 60% succes
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook
| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Wed May 21 13:26:46 EDT 2003 | Brian W.
Something else to keep in mind when you reflow using an IR (non-convection) oven. IR reflow is more susceptible to variations in board mass and coloration than convection ovens. Hi mass areas and dark colored parts will cause more variation in your
Electronics Forum | Thu Feb 17 15:54:35 EST 2005 | JB
Most of our profiles are a variation of one another. Depending on the thicknes and density of the PCB, we make the nescessary changes and then we profile it, to make sure it meets our specs. Check this out: http://www.smtnet.com//forums/index.cfm?
Electronics Forum | Mon Oct 17 17:52:10 EDT 2005 | russ
Lead Free profiles can be achieved on 4 zone ovens on relatively simple boards (I did this for a year). The 4 zones can be a bear to get right for a really optimum profile. Assemblies with significant Delta T designs can be nearly impossible with 4
Electronics Forum | Wed Feb 14 14:11:17 EST 2007 | greg york
We have profiled hundreds of ovens here and it really is dependent on work going through, I walked in on one trial and was faced with an oven that was literally two foot long and told the guy it would not be suited only to profile and run lead free t
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
