Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski
We also use microns to describe solder paste powder particle sizes.
Electronics Forum | Fri Apr 25 10:40:45 EDT 2003 | jonfox
Do you use mass trolleys (slim elements) or standard feeders?
Electronics Forum | Mon Apr 28 02:27:41 EDT 2003 | sal
jON We will be using the slim feeder elements. Sal.
Electronics Forum | Fri Apr 25 14:56:40 EDT 2003 | razor
Please explain the phenomenon of solder leaching on SMD end caps. What is the root cause? What is the best control method?
Electronics Forum | Fri Nov 07 03:50:05 EST 2003 | chrissieneale
Rocky, i would be interested, do you want to email me them direct?
Electronics Forum | Wed Apr 30 21:18:55 EDT 2003 | davef
Morris Why do want to do this [keep solder from pads]?
Electronics Forum | Thu May 01 09:19:59 EDT 2003 | davef
ehess Why do YOU want to block apertures to keep solder from pads?
Electronics Forum | Wed Apr 30 17:17:21 EDT 2003 | swagner
Since you mentioned voids I take it you are talking post reflow correct?
Electronics Forum | Wed Apr 30 18:38:22 EDT 2003 | Guillermo
Yes, I am sorry I forgot to mention that It's inspection after reflow.
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