Electronics Forum | Mon Sep 17 08:40:04 EDT 2001 | dave_bond
I have done a search of the Forum and didn't really see what I was looking for. We could be doing a 12" x 10" x .060" single sided ceramic PCB with all surface mount devices. Are there any "secerts" or "things to watch out for" when processing cerami
Electronics Forum | Fri Sep 21 11:59:26 EDT 2001 | Carol Stirling
We build IPC Class 3 product and are introducing Plastic Ball Grid Arrays. There is a possibility of out-soucing the build, so I'm interested in the Standards or Specifications the industry is quoting to ensure placement, inspection, reliability etc.
Electronics Forum | Thu Sep 27 18:25:20 EDT 2001 | Ed Ruppert
Hello Daniel, You may want to take a look at MYDATA for your large board requirements. MYDATA has board sizes ranging from our smallest of 15"x 20" up to 32"x 44" with other sizes in between. You can find more info at our website: MYDATA.com We ha
Electronics Forum | Wed Oct 10 00:12:42 EDT 2001 | laujh
May I join in this forum also? Does Universal has any new/special platform avaiable in the market to handle board size up to 20" x 32" and thickness 0.300". The current HSP 4796A and GSM1/2 can only handle board size up to 14" x 18" and 18" x 20" r
Electronics Forum | Fri Nov 09 14:34:30 EST 2001 | vickt
As mentioned in other replies, the Universal GSM has expanded capabilities....As for the UIC HSP's....the 4796L can handle an 18" x 20" panel as standard, and has options to go up to 18" x 24.5". Did I mention that the 4796L places at a 0.10 tact ti
Electronics Forum | Mon Oct 08 17:29:44 EDT 2001 | kenbliss
I am looking for a list, names and phone numbers of SMT and thru hole independent process consultants or system integrators, that have extensive expertise in all phases of PC board assembly production and problem solving and have the expertise to han
Electronics Forum | Fri Oct 19 22:55:29 EDT 2001 | ericchua
Hi, Not so sure. I know one of the equipment can do it, there is Kolb RB6D. This system can clean stencil, misprint, assembly board, etc. This Kolb also provide chemcil for the correct cleaner. Hope this can help you. Email to me if you need any he
Electronics Forum | Tue Oct 16 09:17:10 EDT 2001 | davef
Look at "Microcanyons", Circuits Assembly magazine, December 1998. There D Pauls & T Munson describe adhesive on boards that was cured too rapidly and formed a skin that trapped volatiles and solvents. The volatiles and solvents created long voids i
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Tue Nov 27 15:57:58 EST 2001 | mparker
rather than applying jumpers, try thinking it another way. Have all possible jumper connections pre-made by the fab design. Use an exacto or dremel to "open" the undesired paths by removing a bit of copper trace. total flexibility, only one fab make
