Electronics Forum | Mon Sep 28 14:02:15 EDT 2009 | swag
As mentioned previous, check all fuses & breakers. In the AC chassis (should be under black cover beind front, right door), remove cover and check main circuit breaker. Also should be two fuse housings next to breaker - if they are lit up amber, th
Electronics Forum | Wed Sep 30 12:58:35 EDT 2009 | markhoch
I'm just throwing this out there, but is anybody manufacturing large footprint flex circuit PCBs? (I'm talking assemblies 18-36" in length) We're in the midst of quoting a new opportunity that involves several flex circuits of this size. Currently o
Electronics Forum | Thu Nov 19 14:35:02 EST 2009 | rrpowers
We do continuous reel-to-reel flex circuit PCB's with a typical "panel" width being 12". (The PCB pattern repeats every 12".) We have done some product that was 24" by doing one half of the board then the other through the screen printer. We have
Electronics Forum | Thu Oct 01 16:56:40 EDT 2009 | gplume
Does anyone out there have experience soldering with Pb solder (Sn 63 or Sn 62) to SAC 305 coated PCB lands (about 50um) or Sn-Cu plated lands (about 10um). I know soldering Pb free (Sac based soler) to Pb/Sn coated lands is a no-no, but was waonderi
Electronics Forum | Sat Oct 03 01:44:56 EDT 2009 | slthomas
Doug is on to something there, but you may still have other problems. It could be your exec. is corrupt and needs a reload (I sound like a certain UIC tech. support dude) or you could have a hardware problem. Do you vacuum that thing out with any f
Electronics Forum | Tue Oct 13 12:32:43 EDT 2009 | davef
2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers
Electronics Forum | Thu Oct 15 16:11:50 EDT 2009 | rrpowers
We've been using Vi machines for 6 years now and love them. For us they have been quick to program, good at optimizing, and excellent at low false fail rates. The vision tools also gave us more accurate component data. We had problems with high fa
Electronics Forum | Fri Oct 23 12:41:25 EDT 2009 | stepheniii
I used Mirtec's 5 years ago. At this place we have Vi-techs. I can see why the people who recommend Vi-techs do so. They are good machines. However overall I would recommend the Mirtechs. They were faster and easier to program. And they were were a
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
