Electronics Forum: heating (Page 237 of 301)

Cracked Capacitors - Analysis

Electronics Forum | Tue Jul 09 22:12:03 EDT 2019 | eddy2019

The price increase of electronic components such as MLCC has not stopped. In recent years, driven by the development of electric vehicles, industrial control and other industries, the demand for MLCC products has increased rapidly. However, the overa

Looking for trays to lay boards on in reflow oven

Electronics Forum | Sun Jun 09 21:10:11 EDT 2019 | don_julio

In our reflow oven it has pins which move at the predetermined speed to move the pcb through the various zones in the oven. The forward row of pins is fixed along the front of the oven. The rear set of pins is adjustable per the width of the pcb. We

Buying a new Reflow

Electronics Forum | Tue Aug 27 16:39:39 EDT 2019 | spoiltforchoice

There is no formula out there that chooses a model for low volume high mix. Every oven can manage the throughput, which leaves us with cost, servicing, flexibility and reliability. Ersa Pros: Longer heated length than the ovens I am comparing it t

SMD Moisture Sensitive Devices - Baking using vacuum-bake oven - seeking clarification

Electronics Forum | Thu Oct 31 17:24:53 EDT 2019 | slthomas

Sorry I can't really answer any of your questions, but I'm curious about your idea. I've done vacuum drying of implantable medical components (made mostly of a proprietary bio-absorbable composition) but never electronic components. You're right to

solder balls/wash

Electronics Forum | Thu Jan 09 13:18:15 EST 2020 | charliedci

We have been experiencing an issue with solder balls coming out of wave, both RoHS and 63/37, no clean process. It has been determined that a reduction in flux has all but eliminated the solder balls except for where we need to use board stiffeners a

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020

Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay

Reflow Profiling - Cooling Rate?

Electronics Forum | Tue Feb 04 09:21:48 EST 2020 | nhusa

There are two areas that are important when discussing cooling rate. One is the rate thru the liquidus, where a fast rate produces small grains in the metal and a slow rate results in larger grains. Although smaller grains are stronger normal SM

omit stencil apertures to hand solder or paste, reflow then solder.

Electronics Forum | Thu Feb 27 02:55:53 EST 2020 | hexton

I want to avoid peoples preferences as they will differ and will not be a deciding factor. A heat gun will introduce risk to surrounding PTH components and having to add protection for those, will limit any gain in productivity. There is no question

Solder pot & wire tinning help

Electronics Forum | Wed Mar 11 19:22:02 EDT 2020 | victorzubashev

Hi, 1. do not use flux-cored wire- the smell is bad and flux will evaporate anyway at the time of solder wire melting. 2. as suggested use solder bars, something like this: https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=39635

Electronic Assembly - PCB cleansing and COVID-19

Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory

We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi


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