Electronics Forum | Fri Nov 21 14:15:09 EST 2003 | russ
If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works
Electronics Forum | Mon Jan 12 11:51:15 EST 2004 | Hussman
I don't believe you'll get an exact zero flux with no-clean pastes. Water soluable yes, but I don't see it happening with no-clean; at least not this year. As for spatter, you should be able to control this. Can you define what you call "spatter"?
Electronics Forum | Tue Jan 13 19:41:43 EST 2004 | Tom B
Chris, 1. You may want to check lead finish (plating). 2. Is there shadowing? 3. Is Pik-n-Place providing enough pressure to slighlty push part into paste? 4. Is this a new product? or existing? If existing has suppliers for parts changed? 5. Is
Electronics Forum | Wed Mar 03 07:29:34 EST 2004 | pjc
2D will give you on-line contrast inspection for paste coverage on the land. I would go with 2D on the printer when comparing to an AOI that will do the same contrast inspection. There are systems out there that will check paste hieght and area cover
Electronics Forum | Tue Mar 09 03:52:56 EST 2004 | vantott
what you have provided are the settings on the oven and not the temperature profile (which represents the actual temperature experienced by the cards as they pass thru the chambers). Usually, solder paste manufacturers provide recommended specs for
Electronics Forum | Thu Mar 18 23:04:49 EST 2004 | martz
A lot of component vendors already shifted to Pb-free products but our process is still using 63Sn/37Pb solder paste and SMDs. What would be the result if we introduce some Pb-free components to our current process (i.e without changing the reflow p
Electronics Forum | Thu Apr 22 11:46:20 EDT 2004 | rkevin
We used type 4 no clean from Aim too with this application. The price was only about 20 % more than type 3 powder. Works great. They didn't have a long leadtime, my paste was in stock. I have had simalar problems with Indium. They got too big too fas
Electronics Forum | Thu Apr 22 06:42:03 EDT 2004 | Chris Lampron
Adam, What is the pad finish on the flex circuit? Is this the only component that you are having problems with? (on this Flex)If this is the only problem area on the flex (assuming there is more than one component)then that would lead me towards the
Electronics Forum | Wed Apr 28 10:26:29 EDT 2004 | mrmaint
Hello All, I am having trouble with bridges under my BGA's.I am using paste flux. The compresion on the component appears to be good but i am seeing bridges every 1 out of 5 reworked. The alignment before it starts reflowing the part is fine. Dont un
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
