Electronics Forum: tombstoning (Page 25 of 66)

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 14:27:00 EDT 2017 | emeto

Here is some food for thought. Try to answer these questions yourself and I am sure you will see huge improvement. Reasons: - Bad PCB design - Plating-uneven HASL cause more than OSP Au/Ni or Silver - Poor paste and print quality - uneven paste ca

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper

Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris

Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o

Re: Tombstone

Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh

I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper

Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris

Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o

Re: Tombstoning of chip capacitors

Electronics Forum | Tue Aug 24 15:15:43 EDT 1999 | John Thorup

| Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | Any help would be appreciated. Thanks. | Most common reason is uneven heating where one side of the component ach

Tombstone

Electronics Forum | Mon Aug 27 12:29:48 EDT 2001 | ChinaMex

We're producing a quite large scale on PCB's in different sizes and desity as well as various component sizes. Time by time and very sudden we have the Tombstone effect. Evaluations by the technic dept. didn't show the sufficient result of where t

Tombstone on melf resistor

Electronics Forum | Wed Jan 29 18:27:25 EST 2003 | russ

That is one big melf!!! I do not even find this package size in any of my data bases. the largest i have ever dealt with is only .230 in. long. This one is .415 in. long? I would need to know the termination sizes also and then we can figure a pad

Tombstoning in Vapor Phase Process

Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper

Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s


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