Electronics Forum | Thu Jun 13 12:28:41 EDT 2013 | kahrpr
18000 psi is what a injection molding machine can produce depending on the size of machine. When doing over-molding/insert molding the machines are a lot smaller less than 1000 psi and a lot of smaller items less than 500 psi. as far as Temperature 3
Electronics Forum | Mon Jul 01 19:43:44 EDT 2013 | kumar_antom
Hi there, Its a lead free process and the paste that we're using is with this alloy composition : Sn,Ag,Cu,Bi,In.... Pls refer to the attached temp.profile.... This is a mirror Pcb....Same components on both A and B side.... A side doesn't have t
Electronics Forum | Mon Jul 29 15:30:45 EDT 2013 | markhoch
Nitrogen in Reflow is grossly over-rated...., in my opinion, and in the opinion of several very well known SMT Industry "God Fathers". Way too much $$$, for a slight increase in the process window. If you profile your oven specifically for your pr
Electronics Forum | Thu Aug 08 13:09:38 EDT 2013 | cyber_wolf
Hege, there is no actual calibration of the thermocouple itself. You can however verify that they read correctly. Heller sells an option on their reflow ovens specifically for this purpose. I hoping that someone chimes in here that is NADCAP certifi
Electronics Forum | Fri Oct 11 17:10:36 EDT 2013 | hegemon
I think the critical item is that you are soldering in a reduced oxy environment, lowering the rate of ongoing oxidation. Heat accelerates oxidation, lack of oxygen (of course) slows it down. The 10 Nitrogen soldering "myths" seem to be more like "
Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf
No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the
Electronics Forum | Tue Jun 03 12:08:14 EDT 2014 | emeto
I don't think you decide that based on the oven. More important is what kind of parts you have on the board. If you have big heavy parts you should run them as second side.Of course you have the option to put glue under the suspicious part and run it
Electronics Forum | Tue Sep 30 12:16:23 EDT 2014 | tech1
Check your pad sizes against the supplier recommendation. I have noticed that these LED packages are very light and easily move around during reflow. Human nature has us checking the profile and making changes when in fact it is usually something els
Electronics Forum | Mon Nov 03 22:38:39 EST 2014 | dustind
Hi there! I'm an engineering student from Toronto, ON looking for someone to mount a MEMS microphone for me for a school design project. Trouble is, I need a reflow oven for the proper surface mount and my university doesn't have access to one. K
Electronics Forum | Thu Dec 18 08:18:48 EST 2014 | kevinb
Does anybody know what material is used for over molding I/Cs. I would like to find a material that others use to mold there electronic components. I am wire bonding and mounting a small cap (0201) on an FR-4 board. I need this material to withsta
