Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Wed Dec 10 08:30:20 EST 2008 | rgduval
Are you using no-clean solder, or just no clean flux? If you're using a solder with WS flux in the core, and a no-clean flux; we'd suggest switching to a WS flux to help during the soldering. If you are using a no-clean solder/flux combination, you
Electronics Forum | Wed Feb 20 15:20:34 EST 2013 | hegemon
Depending on your requirements, you could range from a hair dryer, heat gun, toaster oven, hot plate, on up to digitally controlled surfaces and convective systems. You'll have to gauge for yourself whether you are just trying to add some heat energy
Electronics Forum | Mon Oct 01 16:41:22 EDT 2001 | davef
We do not assemble with these connectors any longer, we replaced them with a connector from somebody er other, like Teka [one of the pioneers of solder-flux bearing lead technology and a supporter to SMTnet], Samtec, Advanced Interconnections, Mill-M
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Tue Apr 10 13:12:41 EDT 2001 | davef
You've told us nothing about your situation, process, boards, or anything!!! If you leave some boards with very fine solder connections on the shelf for a cuppla years, the grain will become coarse. What do you mean when you say "grainy"? What is
